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Presenter: Farzaneh Taringou
Supervisor: Dr. Jens Bornemann

Date: Fri, April 13, 2012
Time: 14:00:00 - 00:00:00
Place: EOW 430

ABSTRACT

ABSTRACT:

For the purpose of circuit integration in the millimeter-wave frequency regime, substrate-integrated circuits (SICs) have emerged as a successful compromise between conventional Rectangular Waveguide (RWG) and Microstrip (MS) line in terms of loss and Q- factor. It has the add-on advantage that the system can be entirely implemented on a single layer substrate platform and applications have been demonstrated up to the 100 GHz range.

While SIW technology has been largely explored as a low-cost low-profile transmission line in passive microwave and millimeter circuits and devices, little research has been done to assess SIW performance in integration with active elements. The long-term objective of this research is to develop techniques for the integration of SIW with active devices, such as Low Noise Amplifiers (LNAs) or Power Amplifiers (PAs).